NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 167203
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 599
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 428
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 330
 
  
 
H03K PULSE TECHNIQUE 3128
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 264
 
  
 
H04B TRANSMISSION 2208
 
  
 
B01J CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS 1108
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0069,035 Tensile Contact Etch Stop Layer (CESL) For Radio Frequency (RF) Silicon-On-Insulator (SOI) Switch TechnologySep 02, 16Mar 08, 18[H01L]
2017/0338,321 NICKEL SILICIDE IMPLEMENTATION FOR SILICON-ON-INSULATOR (SOI) RADIO FREQUENCY (RF) SWITCH TECHNOLOGYMay 18, 16Nov 23, 17[H03K, H01L, H04B]
2017/0330,789 Structure Having Isolated Deep Substrate Vias With Decreased Pitch And Increased Aspect Ratio And Related MethodJul 31, 17Nov 16, 17[H01L]
2016/0379,926 Semiconductor Wafer Backside Metallization With Improved Backside Metal AdhesionJun 22, 16Dec 29, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9917104 Hybrid MOS-PCM CMOS SOI switchJun 19, 17Mar 13, 18[H01L, H04B]
9887123 Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related methodOct 19, 15Feb 06, 18[H01L]
9751753 Integration of active devices with passive components and MEMS devicesSep 02, 16Sep 05, 17[B81C]
9754814 Integrated passive device having improved linearity and isolationJan 28, 14Sep 05, 17[H01L]
9755063 RF SOI switches including low dielectric constant features between metal line structuresJun 22, 16Sep 05, 17[H01L]
9725306 MEMS device with sealed cavity and method for fabricating sameOct 07, 14Aug 08, 17[H01L, B81C]
9700869 Continuously producing digital micro-scale patterns on a thin polymer filmJul 17, 13Jul 11, 17[B05D, B01J, G03F]
9673081 Isolated through silicon via and isolated deep silicon via having total or partial isolationMay 01, 13Jun 06, 17[H01L]
9673191 Efficient fabrication of BiCMOS devicesMar 17, 15Jun 06, 17[H01L]
9640528 Low-cost complementary BiCMOS integration schemeMar 17, 15May 02, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7589009 Method for fabricating a top conductive layer in a semiconductor die and related structureExpiredDec 18, 06Sep 15, 09[H01L]
7063988 Circuit for detecting arcing in an etch tool during wafer processingExpiredJan 15, 04Jun 20, 06[H01L]
6727716 Probe card and probe needle for high frequency testingExpiredDec 16, 02Apr 27, 04[G01R]
6630710 Elevated channel MOSFETExpiredJul 14, 00Oct 07, 03[H01L]
6586307 Method for controlling an emitter window opening in an HBT and related structureExpiredFeb 14, 02Jul 01, 03[H01L]
6534802 Method for reducing base to collector capacitance and related structureExpiredMay 07, 01Mar 18, 03[H01L]
6490032 Method and apparatus for improving a dark field inspection environmentExpiredMay 31, 00Dec 03, 02[G01N]
6383821 Semiconductor device and processExpiredOct 29, 99May 07, 02[H01L]
6365479 Method for independent control of polycrystalline silicon-germanium in a silicon-germanium HBT and related structureExpiredSep 22, 00Apr 02, 02[H01L]
6207551 Method and apparatus using formic acid vapor as reducing agent for copper wirebondingExpiredAug 24, 99Mar 27, 01[H01L]
6184696 Use of converging beams for transmitting electromagnetic energy to power devices for die testingExpiredMar 23, 98Feb 06, 01[G01R]
6137181 Method for locating active support circuitry on an integrated circuit fabrication dieExpiredSep 24, 99Oct 24, 00[H01L]
6119368 Apparatus for reducing cool chamber particlesExpiredApr 30, 98Sep 19, 00[F26B]
5935397 Physical vapor deposition chamberExpiredApr 30, 98Aug 10, 99[C23C]
5175605 Single event upset hardening circuits, devices and methodsExpiredFeb 05, 90Dec 29, 92[H03K, H01L]
5114867 Sub-micron bipolar devices with method for forming sub-micron contactsExpiredSep 17, 90May 19, 92[H01L]
5114874 Method of making a sub-micron NMOS, PMOS and CMOS devices with methods for forming sub-micron contactsExpiredMay 30, 90May 19, 92[H01L]
5097316 Complementary NPN and PNP lateral transistors separated from substrate by intersecting slots filled with substrate oxide for minimal interference therefromExpiredJun 11, 87Mar 17, 92[H01L]
5051805 Sub-micron bipolar devices with sub-micron contactsExpiredMay 25, 90Sep 24, 91[H01L]
5047828 PNP type lateral transistor with minimal substrate operation interferenceExpiredJun 24, 87Sep 10, 91[H01L]

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